EP2S180F1020C3 vs EP2S180F1508C3 Perbandingan
Perbandingan bersamaan detil EP2S180F1020C3 dari Intel dan EP2S180F1508C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1020C3 | EP2S180F1508C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Unknown |
| Series | Stratix II | Stratix II |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Paket | 1020-ball FBGA (flip-chip BGA) | 1508-BBGA, FCBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C3 | — |
| Suhu Kerja | Commercial (0C to +85C) | [DATA_NEEDED: operating temperature range] |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Array Blocks | — | 8,970 LABs |
| Gate Count | — | 180,000 gates |
| User I/Os | — | 1,170 I/Os |
| Tegangan Pemuat | — | 1.15 V to 1.25 V |
| Supplier Device Package | — | 1508-FBGA (30x30 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1,508 |
| Package Code | — | BGA |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| Transceivers | — | [DATA_NEEDED: transceiver count and speed] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 status] |