EP3C40F780C7 vs EP3C40F780C8N Perbandingan
Perbandingan bersamaan detil EP3C40F780C7 dari Intel dan EP3C40F780C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780C7 | EP3C40F780C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | 39,600 |
| Number of Logic Cells | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | 1,161,216 bits |
| Embedded 18x18 Multipliers | 126 | 126 (up to 396 9x9) |
| Number of PLLs | 4 | 4 |
| User I/O Count | 535 | — |
| I/O Banks | 8 | — |
| Paket | 780-ball FBGA (F780) | 780-ball FBGA, 1.0mm pitch |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Suhu Kerja | 0C to +85C (Commercial) | 0°C to +85°C (Commercial) |
| Speed Grade | C7 | 8 (C8) |
| Process Technology | 60 nm TSMC low-power CMOS | 65nm TSMC low-power |
| Configuration | Active Serial / Passive Parallel (JTAG) | — |
| Level MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | Compliant |
| Series | — | Cyclone® III |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Tipe Mounting | — | Surface Mount (BGA) |
| Configuration Modes | — | AS, PS, FPP, JTAG |