EP3C40F780C7N vs EP3C40F780C7 Perbandingan
Perbandingan bersamaan detil EP3C40F780C7N dari Intel dan EP3C40F780C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780C7N | EP3C40F780C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | — |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Paket | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F780) |
| Speed Grade | 7 (C7, commercial) | C7 |
| Process Node | 65 nm TSMC low-power | — |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Logic Elements (LE) | — | 39,600 |
| Number of Logic Cells | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Embedded 18x18 Multipliers | — | 126 |
| Number of PLLs | — | 4 |
| User I/O Count | — | 535 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Process Technology | — | 60 nm TSMC low-power CMOS |
| Configuration | — | Active Serial / Passive Parallel (JTAG) |
| Level MSL | — | 3 (168 hours) |
| Status RoHS | — | Compliant |