EP3C40F780C8N vs EP3C55F780C6N Perbandingan
Perbandingan bersamaan detil EP3C40F780C8N dari Intel dan EP3C55F780C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780C8N | EP3C55F780C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III | Cyclone III |
| Family | Cyclone III | Cyclone III FPGA |
| Logic Elements (LE) | 39,600 | 55,856 |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | 312 |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Suhu Kerja | 0°C to +85°C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 8 (C8) | C6 |
| Paket | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (F780) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Process Technology | 65nm TSMC low-power | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Maximum User I/O | — | 377 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |