EP3C40F780I8N vs EP3C40F780I7 Perbandingan
Perbandingan bersamaan detil EP3C40F780I8N dari Intel dan EP3C40F780I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F780I8N | EP3C40F780I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone® III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | 126 |
| Number of PLLs | 4 | — |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | — |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Paket | 780-ball FBGA (F780) | 780-ball FineLine BGA (F780) |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm low-power CMOS |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | — |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Logic Elements (LEs) | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 bits |
| M9K Memory Blocks | — | 234 |
| MLAB Memory Bits | — | 112,500 bits |
| 9-bit Multiplier Elements | — | 535 |
| PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Maximum Operating Frequency | — | 472.5 MHz |
| Core Voltage (VCCINT) | — | 1.2 V |
| Package Dimensions | — | [DATA_NEEDED: package dimensions in mm] |
| Suhu Kerja | — | -40C to +100C (industrial, I7) |
| Configuration Method | — | JTAG / Active Serial / Passive Serial |
| Toolchain | — | Quartus II / Quartus Prime |