EP3C55F780C7N vs EP3C55F780I7N Perbandingan
Perbandingan bersamaan detil EP3C55F780C7N dari Intel dan EP3C55F780I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F780C7N | EP3C55F780I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Suhu Kerja | 0C to +85C (commercial, C7 speed grade) | — |
| Paket | 780-ball FineLine BGA | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) |
| Speed Grade | 7 | -7 (fastest) |
| Status RoHS | Compliant | — |
| Total RAM Bits | — | 2,396,160 |
| Number of Logic Array Blocks (LABs) | — | 2,426 |
| Embedded 18x18 Multipliers | — | 56 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O Count | — | 377 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Maximum Internal Frequency | — | 472 MHz |
| Tipe Mounting | — | Surface Mount |
| Lead-Free / RoHS | — | Lead free, RoHS compliant |
| Configuration Scheme | — | Passive Serial / JTAG / Active Serial |