EP3C55F780I7N vs EP3C55F780C6 Perbandingan
Perbandingan bersamaan detil EP3C55F780I7N dari Intel dan EP3C55F780C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F780I7N | EP3C55F780C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Logic Elements | 55,856 | 55,856 |
| Total RAM Bits | 2,396,160 | — |
| Number of Logic Array Blocks (LABs) | 2,426 | — |
| Embedded 18x18 Multipliers | 56 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/O Count | 377 | — |
| Core Voltage | 1.2 V | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| Maximum Internal Frequency | 472 MHz | — |
| Process Technology | 65 nm | 65 nm low power |
| Paket | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) | 780-ball FBGA |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead free, RoHS compliant | — |
| Configuration Scheme | Passive Serial / JTAG / Active Serial | — |
| Speed Grade | -7 (fastest) | -6 (C6) |
| Series | — | Cyclone III |
| Embedded Memory Bits | — | 2,396,160 |
| Number of Block RAM (M9K) | — | 260 |
| 18x18 Hardware Multipliers | — | 156 |
| User I/Os | — | 377 |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Configuration Methods | — | JTAG, AS, AP, PS |
| Number of PLLs | — | 4 |
| Maximum User I/O Voltage Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Status RoHS | — | Compliant |