EP3CLS200F484C7N vs EP3CLS200F484I7 Perbandingan
Perbandingan bersamaan detil EP3CLS200F484C7N dari Intel dan EP3CLS200F484I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F484C7N | EP3CLS200F484I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 198464 |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Paket | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Kerja | 0C to +85C (commercial) | -40 °C to +85 °C (Industrial) |
| Process Technology | 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| Status RoHS | Compliant | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Device Family | — | Cyclone III LS |
| CLBs | — | 198464 |
| Total Memory Bits | — | 8211456 bits (~1.0 MB) |
| Embedded Memory Blocks | — | 432 M9K blocks |
| User I/O Pins | — | 210 |
| Maximum Operating Frequency | — | 450 MHz |
| Number of PLLs | — | 4 |
| Tegangan Pemuat | — | 1.2 V |
| Bitstream Encryption | — | AES (Cyclone III LS feature) |