EP3CLS200F484C7N vs EP3CLS200F484I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C7N sa pamamagitan ng Intel at EP3CLS200F484I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F484C7N | EP3CLS200F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 198464 |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Packhaging | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 °C to +85 °C (Industrial) |
| Process Technology | 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| Tindminan RoHS | Compliant | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Device Family | — | Cyclone III LS |
| CLBs | — | 198464 |
| Total Memory Bits | — | 8211456 bits (~1.0 MB) |
| Embedded Memory Blocks | — | 432 M9K blocks |
| User I/O Pins | — | 210 |
| Maximum Operating Frequency | — | 450 MHz |
| Number of PLLs | — | 4 |
| Volte ng Pagbibigay | — | 1.2 V |
| Bitstream Encryption | — | AES (Cyclone III LS feature) |