EP3CLS200F484C8 vs EP3CLS150F484C8 Perbandingan
Perbandingan bersamaan detil EP3CLS200F484C8 dari Intel dan EP3CLS150F484C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F484C8 | EP3CLS150F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Cyclone III LS | — |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 150848 |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | — |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Paket | 484-pin FBGA (FineLine BGA) | 484-ball FBGA |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Suhu Kerja | 0C to +85C (commercial, 'C' suffix) | 0 C to +85 C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 6137856 |
| Total RAM Blocks | — | [DATA_NEEDED: number of M9K blocks] |
| User I/O Count | — | 210 |
| Global Clock Networks | — | [DATA_NEEDED: number of global clocks] |
| Speed Grade | — | C8 |
| Maximum Internal Frequency | — | 402 MHz |
| Configuration Memory | — | SRAM-based, AES bitstream encryption supported |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED] |