EP3SE260F1152C2G vs EP3SE260F1152C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C2G dari Altera dan EP3SE260F1152C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Altera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoleteIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C2G | EP3SE260F1152C3N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Family | Stratix III E | — |
| Series | EP3SE260 | Stratix III E |
| Logic Elements / Cells | 255000 | 255,000 |
| Total RAM Bits | 16672768 | — |
| Number of LABs / CLBs | 10200 | — |
| Number of I/O | 744 | — |
| Number of Terminals | 1152 | — |
| Paket | 1152-BBGA, FCBGA (FineLine BGA) | 1152-BBGA, FCBGA |
| Package Code | BGA (Ball Grid Array) | — |
| Package Shape | Square | — |
| Technology / Process Node | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C2 (commercial) | — |
| Lead-Free (RoHS) | Yes (G suffix) | — |
| Operating Temperature Grade | Commercial (C) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Supply Packaging | Tray | — |
| Status RoHS | Compliant (G suffix) | Compliant |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 744 |
| Process Technology | — | 65 nm |
| Suhu Kerja | — | 0 C to +85 C (Commercial) |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |