EP3SE260F1152C2N vs EP3SE260F1152I3G Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C2N dari Intel dan EP3SE260F1152I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C2N EP3SE260F1152I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array Stratix III
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Tipe Mounting Surface Mount Surface Mount (BGA)
Suhu Kerja [DATA_NEEDED: operating temperature grade] —
Paket / Case 1152-BBGA, FCBGA —
Process Technology 65 nm 40 nm TSMC low-power
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
Level MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant [DATA_NEEDED: RoHS compliance not stated in scraped data]
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,640 bits
Embedded Memory Bits (alternate) — 20,880 Kb (16,672,640 / 1024)
User I/O Count — 744
Paket — 1152-BBGA, FCBGA (FineLine BGA)
Rentang Suhu Kerja — -40C to +100C (Industrial)
Speed Grade — I3 (Industrial, balanced)
Supply Voltage Core — 0.9 V (typical, see handbook)
Configuration Bitstream Encryption — AES-256 (Stratix III feature)
I/O Standards Supported — LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X
Tingkat Sensitivitas Kekeringan (MSL) — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
Lead-Free Reflow — [DATA_NEEDED: peak reflow temperature]
Design Toolchain — Quartus II / Quartus Prime
Country of Origin / Distribution — Multiple authorized distributors (DigiKey, Mouser)

Spek dan Sumber

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