EP3SL50F780C2N vs EP3SL50F780C2 Perbandingan
Perbandingan bersamaan detil EP3SL50F780C2N dari Intel dan EP3SL50F780C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F780C2N | EP3SL50F780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix III L | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 47,500 | — |
| Configurable Logic Blocks (LABs) | 1,900 | — |
| Embedded Memory | 2,184,192 bits | — |
| User I/Os | 488 | — |
| Paket | 780-ball FBGA (FCBGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Internal Fabric Frequency (max) | 800 MHz | — |
| Process Technology | 65 nm | 65 nm |
| Core Supply Voltage | 0.9 V | — |
| Speed Grade | C2 | — |
| Suhu Kerja | 0 °C to 85 °C (Commercial) | 0°C to +85°C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Status Lingkungan Hidup | Not Recommended for New Designs (NRND) | — |
| Family | — | Stratix III L |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |