EP3SL50F780C2N vs EP3SL50F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C2N sa pamamagitan ng Intel at EP3SL50F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F780C2N | EP3SL50F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix III L | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 47,500 | — |
| Configurable Logic Blocks (LABs) | 1,900 | — |
| Embedded Memory | 2,184,192 bits | — |
| User I/Os | 488 | — |
| Packhaging | 780-ball FBGA (FCBGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Internal Fabric Frequency (max) | 800 MHz | — |
| Process Technology | 65 nm | 65 nm |
| Core Supply Voltage | 0.9 V | — |
| Speed Grade | C2 | — |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | 0°C to +85°C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Katayuan ng Lifecycle | Not Recommended for New Designs (NRND) | — |
| Family | — | Stratix III L |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |