EP3SL70F484I3 vs EP3SL70F484I4 Perbandingan
Perbandingan bersamaan detil EP3SL70F484I3 dari Intel dan EP3SL70F484I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
EP3SL70F484I3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SL70F484I3 | EP3SL70F484I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | Stratix III L | Stratix III |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | — |
| Suhu Kerja | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Paket | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-BBGA, FCBGA |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| Status RoHS | Compliant | Compliant |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 67,500 |
| Embedded Memory (bits) | — | 2,699,264 |
| Embedded Multipliers (18x18) | — | 488 |
| Maximum User I/O | — | 296 |
| Tipe Mounting | — | Surface Mount |
| Core Voltage | — | 1.0 V |
| Process Technology | — | 40 nm CMOS |
| Tipe Memori | — | TriMatrix (10 Kb / 640-bit MLAB) |
| PLL Count | — | 8 high-speed + 16 general-purpose |