EP3SL70F484I3 vs EP3SL70F484I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484I3 sa pamamagitan ng Intel at EP3SL70F484I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F484I3 | EP3SL70F484I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L | Stratix III |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | — |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Packhaging | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-BBGA, FCBGA |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 67,500 |
| Embedded Memory (bits) | — | 2,699,264 |
| Embedded Multipliers (18x18) | — | 488 |
| Maximum User I/O | — | 296 |
| Uri ng Pagpapasok | — | Surface Mount |
| Core Voltage | — | 1.0 V |
| Process Technology | — | 40 nm CMOS |
| Uri ng Memory | — | TriMatrix (10 Kb / 640-bit MLAB) |
| PLL Count | — | 8 high-speed + 16 general-purpose |