EP4CE55F29C9LN vs EP4CE75F29C9LN Perbandingan
Perbandingan bersamaan detil EP4CE55F29C9LN dari Intel dan EP4CE75F29C9LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F29C9LN | EP4CE75F29C9LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 75,408 |
| Embedded Memory | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 374 | 200 |
| Logic Array Blocks (LAB) | 3,491 | [DATA_NEEDED: exact LAB count for EP4CE75] |
| M9K Memory Blocks | 260 | — |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 374 | — |
| Technology Node | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Suhu Hubung Kerja | 0 °C to 85 °C (commercial) | — |
| Paket | 780-ball FBGA (F29) | 780-FBGA (F29) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | Yes (Pb-free terminal finish, suffix 'N') | — |
| Speed Grade | C9 | C9 |
| Total RAM Bits | — | 2,810,880 bits |
| User I/O Pins | — | 426 |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (0C to +85C) |
| Process Node | — | 60 nm (TSMC) |
| Core Voltage | — | [DATA_NEEDED: VCCINT value from datasheet] |
| Tegangan Pemuat | — | 1.2 V (per DigiChip summary) |
| Configuration Modes | — | JTAG, Active Serial, Active Parallel, Passive Serial |
| Status RoHS | — | Compliant (Pb-free finish, "L" suffix) |