EP4CE6F17C6 vs EP4CE6F17C9L Perbandingan
Perbandingan bersamaan detil EP4CE6F17C6 dari Intel dan EP4CE6F17C9L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE6F17C6 | EP4CE6F17C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | 6,272 |
| Configurable Logic Blocks (CLB) | 392 | — |
| Embedded Memory | 276,480 bits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | 2 |
| Maximum User I/O | 179 | — |
| Paket | 256-FBGA 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial) | — |
| Suhu Hubung Kerja | 0°C to 85°C | 0C to 85C (commercial) |
| Core Voltage VCCINT | 1.2 V (typical) | — |
| Process Node | 60 nm low-power | — |
| I/O Banks | 8 | — |
| Memory Blocks | M9K (30 blocks) | — |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | AS, PS, JTAG |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Tipe Mounting | Surface Mount (FBGA) | Surface Mount (BGA) |
| Level MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Series | — | Cyclone IV E |
| Embedded Memory Bits | — | 276,480 |
| Maximum User I/O Pins | — | 179 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Multipliers (18x18) | — | 15 |
| Global Clock Networks | — | 10 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 60 nm |