EP4CGX75DF27C6N vs EP4CGX75DF27C7 Perbandingan
Perbandingan bersamaan detil EP4CGX75DF27C6N dari Intel dan EP4CGX75DF27C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX75DF27C6N | EP4CGX75DF27C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Logic Array Blocks (LABs) | 4,630 | — |
| Total Memory Bits | 4,257,792 | — |
| Embedded Multipliers (18x18) | 310 | — |
| Maximum User I/O | 310 (FBGA-672) | — |
| Process Technology | 60 nm low power | — |
| Core Supply Voltage | 1.2 V | — |
| Number of Transceivers | 4 (up to 3.125 Gbps) | — |
| Paket | 672-ball FineLine BGA (FBGA) | 672-ball FBGA |
| Speed Grade | C6 (slowest commercial) | — |
| Suhu Kerja | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature range] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Level MSL | 3 | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Tegangan Pemuat | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |