EP4CGX75DF27C6N vs EP4CGX75DF27C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75DF27C6N sa pamamagitan ng Intel at EP4CGX75DF27C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75DF27C6N | EP4CGX75DF27C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Logic Array Blocks (LABs) | 4,630 | — |
| Total Memory Bits | 4,257,792 | — |
| Embedded Multipliers (18x18) | 310 | — |
| Maximum User I/O | 310 (FBGA-672) | — |
| Process Technology | 60 nm low power | — |
| Core Supply Voltage | 1.2 V | — |
| Number of Transceivers | 4 (up to 3.125 Gbps) | — |
| Packhaging | 672-ball FineLine BGA (FBGA) | 672-ball FBGA |
| Speed Grade | C6 (slowest commercial) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Level ng MSL | 3 | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Volte ng Pagbibigay | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |