EP4SGX110HF35C3G vs EP4SGX70HF35C3G Perbandingan
Perbandingan bersamaan detil EP4SGX110HF35C3G dari Intel dan EP4SGX70HF35C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX110HF35C3G | EP4SGX70HF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Sub-family | GX (transceiver-optimized) | — |
| Logic Elements | 105,600 | 72,600 |
| Embedded Memory Bits | 9,793,536 | — |
| Embedded Memory (Kbits) | 9,564 Kbit (9793536 bits) | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Maximum User I/O | 488 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Number of Transceivers | 8 | 8 |
| Transceiver Data Rate | 3.125 Gbps (low-power mode) - 8.5 Gbps | — |
| 18x18 Multipliers | [DATA_NEEDED: DSP block count] | — |
| PCIe Hard IP | Yes | — |
| Paket | 1152-BBGA, FCBGA (HF35, 35x35 mm) | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Package Code | HF35 (FineLine BGA, 35mm) | — |
| Speed Grade | C3 (commercial) | HF35 |
| Suhu Kerja | [DATA_NEEDED: junction temperature range] | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free FBGA) | Compliant |
| Level MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |