EP4SGX110HF35C3G vs EP4SGX70HF35C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX110HF35C3G disebabkan oleh Intel dan EP4SGX70HF35C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX110HF35C3G | EP4SGX70HF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Sub-family | GX (transceiver-optimized) | — |
| Logic Elements | 105,600 | 72,600 |
| Embedded Memory Bits | 9,793,536 | — |
| Embedded Memory (Kbits) | 9,564 Kbit (9793536 bits) | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Maximum User I/O | 488 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Number of Transceivers | 8 | 8 |
| Transceiver Data Rate | 3.125 Gbps (low-power mode) - 8.5 Gbps | — |
| 18x18 Multipliers | [DATA_NEEDED: DSP block count] | — |
| PCIe Hard IP | Yes | — |
| Kemasan | 1152-BBGA, FCBGA (HF35, 35x35 mm) | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Package Code | HF35 (FineLine BGA, 35mm) | — |
| Speed Grade | C3 (commercial) | HF35 |
| Suhu Operasi | [DATA_NEEDED: junction temperature range] | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free FBGA) | Compliant |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |