EPM1270T144C3N vs EPM1270TI144C5N Perbandingan
Perbandingan bersamaan detil EPM1270T144C3N dari Intel dan EPM1270TI144C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM1270T144C3N | EPM1270TI144C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | MAX II | — |
| Logic Elements (LEs) | 1270 | — |
| Equivalent Macrocells | 980 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum User I/O | 212 | — |
| Operating Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Internal Performance | [DATA_NEEDED: max internal frequency MHz] | — |
| Pin-to-Pin Delay (tPD) | [DATA_NEEDED: ns by speed grade] | 6.2 ns |
| Speed Grade | C3 (commercial, -3) | — |
| Paket | 144-pin TQFP (T144) | 144-pin TQFP |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: lead-free / RoHS variant not confirmed for -5N TI suffix] |
| LE Family | MAX II (low-power, non-volatile) | — |
| Family | — | MAX II |
| Device | — | EPM1270 |
| Logic Elements / Macro Cells | — | 980 macro cells |
| User I/O Count | — | 212 (max for device, 116 used in 144-pin package context) |
| Maximum Operating Frequency (fMAX) | — | 201.1 MHz |
| Technology Node | — | 0.18 µm |
| Core Voltage (VCCINT) | — | 3.0 V to 3.6 V (3.3 V typ) |
| User Flash Memory | — | 8 Kbit (shared with config block) |
| Rentang Suhu Kerja | — | -40 °C to +100 °C (industrial, TI suffix) |
| JTAG / ISP | — | Yes (IEEE 1149.1 boundary scan, in-system programmable) |