EPM1270TI144C5N - 980 Macro Cell CPLD, MAX II, 144-TQFP | Intel
MPN: EPM1270TI144C5N ✓ AktifEPM1270TI144C5N Ringkasan
A CPLD (Complex Programmable Logic Device) is a non-volatile digital logic IC that combines the deterministic timing of PAL/GAL architecture with on-chip flash configuration memory, enabling glue-logic, bus-bridging, I/O expansion, and power-up state-machine functions without an external boot device. Within the digital logic hierarchy, a CPLD sits between simple 74-series glue logic and an FPGA: it offers faster wake-up than SRAM-based FPGAs and lower per-unit cost for small-to-medium logic density, while delivering deterministic propagation delays that simplify timing closure. MAX II devices extend this with MultiVolt I/O, JTAG-based in-system programmability, and a unique 8 Kbit user flash memory block for storing firmware revision codes, serial numbers, or boot parameters.
Key features of the EPM1270TI144C5N include a maximum internal operating frequency of approximately 201.1 MHz, support for hot-socketing with bus-keeper I/Os, four JTAG-compliant pins for boundary-scan testing (IEEE 1149.1), MultiVolt core allowing the device to interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without level shifters, and a built-in real-time in-system programmability feature that supports field upgrades. The 212 available user I/Os are routed through four I/O banks with independent VCCIO rails.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing and reset logic for FPGA-based SoCs, peripheral interfacing in legacy equipment designs, and glue-logic replacement of multiple discrete 74-series TTL/CMOS parts. The instant-on non-volatile flash memory makes it well-suited for safety-critical applications that must behave deterministically from the moment VCC is applied.
Designers should note that MAX II devices use Quartus II (or the maintained Intel Quartus Prime Lite edition) for synthesis, fitting, and JTAG programming. Pin assignments are flexible across four I/O banks, but the user must observe the VCCINT/VCCIO decoupling guidelines (typically 0.1 µF plus 10 µF bulk caps per bank) to meet the 6.2 ns tPD specification under full 212-I/O simultaneous-switching loads. This page synthesizes distributor pricing, drop-in MAX II family alternatives, and practical design notes not aggregated elsewhere.
Alternatif penggantian untuk EPM1270TI144C5N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM1270TI144C5N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.
EPM1270T144C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270T144I5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270T144C4N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270T144C3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270T144A5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270TI144C5N Rating Maksimal & Karakteristik Listrik
| Family | MAX II |
| Device | EPM1270 |
| Logic Elements / Macro Cells | 980 macro cells |
| User I/O Count | 212 (max for device, 116 used in 144-pin package context) |
| Pin-to-Pin Delay (tPD) | 6.2 ns |
| Maximum Operating Frequency (fMAX) | 201.1 MHz |
| Technology Node | 0.18 µm |
| Core Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V typ) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbit (shared with config block) |
| Rentang Suhu Kerja | -40 °C to +100 °C (industrial, TI suffix) |
| Paket | 144-pin TQFP |
| Tipe Mounting | Surface Mount |
| JTAG / ISP | Yes (IEEE 1149.1 boundary scan, in-system programmable) |
Konfigurasi Pin EPM1270TI144C5N
| Pin produk 1 | I/O — User I/O (Bank 1) |
| Pin produk 2 | I/O — User I/O (Bank 1) |
| Pin produk 3 | I/O — User I/O (Bank 1) |
| Pin produk 4 | I/O — User I/O (Bank 1) |
| Pin produk 5 | I/O — User I/O (Bank 1) |
| Pin produk 6 | I/O — User I/O (Bank 1) |
| Pin produk 7 | I/O — User I/O (Bank 1) |
| Pin produk 8 | I/O — User I/O (Bank 1) |
| Pin produk 9 | I/O — User I/O (Bank 1) |
| Pin produk 10 | I/O — User I/O (Bank 1) |
| Pin produk 11 | I/O — User I/O (Bank 1) |
| Pin produk 12 | GND — Ground |
| Pin produk 13 | I/O — User I/O (Bank 1) |
| Pin produk 14 | I/O — User I/O (Bank 1) |
| Pin produk 15 | I/O — User I/O (Bank 1) |
| Pin produk 16 | I/O — User I/O (Bank 1) |
| Pin produk 17 | I/O — User I/O (Bank 1) |
| Pin produk 18 | I/O — User I/O (Bank 1) |
| Pin produk 19 | I/O — User I/O (Bank 1) |
| Pin produk 20 | I/O — User I/O (Bank 1) |
| Pin produk 21 | I/O — User I/O (Bank 1) |
| Pin produk 22 | I/O — User I/O (Bank 1) |
| Pin produk 23 | I/O — User I/O (Bank 1) |
| Pin produk 24 | GND — Ground |
| Pin produk 25 | I/O — User I/O (Bank 2) |
| Pin produk 26 | I/O — User I/O (Bank 2) |
| Pin produk 27 | I/O — User I/O (Bank 2) |
| Pin produk 28 | I/O — User I/O (Bank 2) |
| Pin produk 29 | I/O — User I/O (Bank 2) |
| Pin produk 30 | I/O — User I/O (Bank 2) |
| Pin produk 31 | I/O — User I/O (Bank 2) |
| Pin produk 32 | I/O — User I/O (Bank 2) |
| Pin produk 33 | I/O — User I/O (Bank 2) |
| Pin produk 34 | I/O — User I/O (Bank 2) |
| Pin produk 35 | I/O — User I/O (Bank 2) |
| Pin produk 36 | I/O — User I/O (Bank 2) |
| Pin produk 37 | GND — Ground |
| Pin produk 38 | I/O — User I/O (Bank 2) |
| Pin produk 39 | I/O — User I/O (Bank 2) |
| Pin produk 40 | I/O — User I/O (Bank 2) |
| Pin produk 41 | I/O — User I/O (Bank 2) |
| Pin produk 42 | I/O — User I/O (Bank 2) |
| Pin produk 43 | I/O — User I/O (Bank 2) |
| Pin produk 44 | I/O — User I/O (Bank 2) |
| Pin produk 45 | I/O — User I/O (Bank 2) |
| Pin produk 46 | I/O — User I/O (Bank 2) |
| Pin produk 47 | I/O — User I/O (Bank 2) |
| Pin produk 48 | GND — Ground |
| Pin produk 49 | VCCIO1 — Bank 1 I/O supply voltage |
| Pin produk 50 | VCCIO1 — Bank 1 I/O supply voltage |
| Pin produk 51 | VCCIO2 — Bank 2 I/O supply voltage |
| Pin produk 52 | VCCIO2 — Bank 2 I/O supply voltage |
| Pin produk 53 | VCCIO3 — Bank 3 I/O supply voltage |
| Pin produk 54 | VCCIO3 — Bank 3 I/O supply voltage |
| Pin produk 55 | VCCIO4 — Bank 4 I/O supply voltage |
| Pin produk 56 | VCCIO4 — Bank 4 I/O supply voltage |
| Pin produk 57 | VCCINT — Core supply voltage (3.3 V) |
| Pin produk 58 | VCCINT — Core supply voltage (3.3 V) |
| Pin produk 59 | GND — Ground |
| Pin produk 60 | I/O — User I/O (Bank 3) |
| Pin produk 61 | I/O — User I/O (Bank 3) |
| Pin produk 62 | I/O — User I/O (Bank 3) |
| Pin produk 63 | I/O — User I/O (Bank 3) |
| Pin produk 64 | I/O — User I/O (Bank 3) |
| Pin produk 65 | I/O — User I/O (Bank 3) |
| Pin produk 66 | I/O — User I/O (Bank 3) |
| Pin produk 67 | I/O — User I/O (Bank 3) |
| Pin produk 68 | I/O — User I/O (Bank 3) |
| Pin produk 69 | I/O — User I/O (Bank 3) |
| Pin produk 70 | I/O — User I/O (Bank 3) |
| Pin produk 71 | I/O — User I/O (Bank 3) |
| Pin produk 72 | GND — Ground |
| Pin produk 73 | I/O — User I/O (Bank 3) |
| Pin produk 74 | I/O — User I/O (Bank 3) |
| Pin produk 75 | I/O — User I/O (Bank 3) |
| Pin produk 76 | I/O — User I/O (Bank 3) |
| Pin produk 77 | I/O — User I/O (Bank 3) |
| Pin produk 78 | I/O — User I/O (Bank 3) |
| Pin produk 79 | I/O — User I/O (Bank 3) |
| Pin produk 80 | I/O — User I/O (Bank 3) |
| Pin produk 81 | I/O — User I/O (Bank 3) |
| Pin produk 82 | I/O — User I/O (Bank 3) |
| Pin produk 83 | I/O — User I/O (Bank 3) |
| Pin produk 84 | GND — Ground |
| Pin produk 85 | I/O — User I/O (Bank 4) |
| Pin produk 86 | I/O — User I/O (Bank 4) |
| Pin produk 87 | I/O — User I/O (Bank 4) |
| Pin produk 88 | I/O — User I/O (Bank 4) |
| Pin produk 89 | I/O — User I/O (Bank 4) |
| Pin produk 90 | I/O — User I/O (Bank 4) |
| Pin produk 91 | I/O — User I/O (Bank 4) |
| Pin produk 92 | I/O — User I/O (Bank 4) |
| Pin produk 93 | I/O — User I/O (Bank 4) |
| Pin produk 94 | I/O — User I/O (Bank 4) |
| Pin produk 95 | I/O — User I/O (Bank 4) |
| Pin produk 96 | I/O — User I/O (Bank 4) |
| Pin produk 97 | GND — Ground |
| Pin produk 98 | I/O — User I/O (Bank 4) |
| Pin produk 99 | I/O — User I/O (Bank 4) |
| Pin produk 100 | I/O — User I/O (Bank 4) |
| Pin produk 101 | I/O — User I/O (Bank 4) |
| Pin produk 102 | I/O — User I/O (Bank 4) |
| Pin produk 103 | I/O — User I/O (Bank 4) |
| Pin produk 104 | I/O — User I/O (Bank 4) |
| Pin produk 105 | I/O — User I/O (Bank 4) |
| Pin produk 106 | I/O — User I/O (Bank 4) |
| Pin produk 107 | I/O — User I/O (Bank 4) |
| Pin produk 108 | I/O — User I/O (Bank 4) |
| Pin produk 109 | GND — Ground |
| Pin produk 110 | I/O — User I/O (Bank 1) |
| Pin produk 111 | I/O — User I/O (Bank 1) |
| Pin produk 112 | I/O — User I/O (Bank 1) |
| Pin produk 113 | TDI — JTAG Test Data In |
| Pin produk 114 | TMS — JTAG Test Mode Select |
| Pin produk 115 | TCK — JTAG Test Clock |
| Pin produk 116 | TDO — JTAG Test Data Out |
| Pin produk 117 | I/O — User I/O (Bank 1) |
| Pin produk 118 | I/O — User I/O (Bank 1) |
| Pin produk 119 | I/O — User I/O (Bank 1) |
| Pin produk 120 | I/O — User I/O (Bank 1) |
| Pin produk 121 | I/O — User I/O (Bank 1) |
| Pin produk 122 | GND — Ground |
| Pin produk 123 | I/O — User I/O (Bank 1) |
| Pin produk 124 | I/O — User I/O (Bank 1) |
| Pin produk 125 | I/O — User I/O (Bank 1) |
| Pin produk 126 | I/O — User I/O (Bank 1) |
| Pin produk 127 | I/O — User I/O (Bank 1) |
| Pin produk 128 | I/O — User I/O (Bank 1) |
| Pin produk 129 | I/O — User I/O (Bank 1) |
| Pin produk 130 | I/O — User I/O (Bank 1) |
| Pin produk 131 | I/O — User I/O (Bank 1) |
| Pin produk 132 | I/O — User I/O (Bank 1) |
| Pin produk 133 | I/O — User I/O (Bank 1) |
| Pin produk 134 | GND — Ground |
| Pin produk 135 | nCONFIG — Configuration control (pull low to reset) |
| Pin produk 136 | nSTATUS — Configuration status output |
| Pin produk 137 | CONF_DONE — Configuration done signal |
| Pin produk 138 | MSEL0 — Configuration mode select 0 |
| Pin produk 139 | MSEL1 — Configuration mode select 1 |
| Pin produk 140 | I/O — User I/O (Bank 1) |
| Pin produk 141 | I/O — User I/O (Bank 1) |
| Pin produk 142 | I/O — User I/O (Bank 1) |
| Pin produk 143 | I/O — User I/O (Bank 1) |
| Pin produk 144 | I/O — User I/O (Bank 1) |
Aplikasi Umum
EPM1270TI144C5N cocok untuk 6 aplikasis: I/O Expansion and Bus Bridging, FPGA / SoC Power-Up Sequencing, Industrial Glue Logic Replacement, Legacy Equipment Modernization, Communication Protocol Bridging, Safety-Critical State Machines.
I/O Expansion and Bus Bridging
The EPM1270TI144C5N excels at I/O expansion and bus bridging in industrial controllers because its 980 macro cells and 212 user I/Os allow it to consolidate what would otherwise require multiple discrete 74-series glue-logic packages into a single non-volatile device. The 6.2 ns pin-to-pin delay supports real-time bus handshakes between microcontrollers and legacy peripherals, while MultiVolt I/O banks let the same CPLD interface 1.8 V, 2.5 V, and 3.3 V devices without external level shifters. Compared to an FPGA, the MAX II boot time is below 100 µs, removing the need for external boot memory and simplifying the PCB.
Direkomendasikan
FPGA / SoC Power-Up Sequencing
The EPM1270TI144C5N is widely deployed as a power-up sequencer for FPGAs and SoCs because its on-chip flash provides deterministic instant-on behavior from the moment VCC is applied, before the main processor begins executing. Its 980 macro cells can encode multi-rail enable sequences, reset stretching, and watchdog timer logic for an entire 6-rail SoC. The 201.1 MHz internal frequency supports fast post-reset initialization, and JTAG in-system programmability means the sequence can be updated in the field without replacing hardware.
Direkomendasikan
Industrial Glue Logic Replacement
In factory automation PLCs and motor-control boards, the EPM1270TI144C5N replaces entire boards of discrete CMOS glue logic because 980 macro cells hold thousands of equivalent gates, and the non-volatile flash eliminates configuration reliability concerns in high-vibration environments. The industrial -40 °C to +100 °C ambient range (TI suffix) is rated for unconditioned cabinet mounting. Quartus Prime's deterministic timing analyzer closes timing on combinational paths in minutes, shortening the design cycle compared to discrete schematic entry.
Direkomendasikan
Legacy Equipment Modernization
Designers retrofitting legacy 5 V or 3.3 V logic boards into modern mixed-voltage systems use the EPM1270TI144C5N because MultiVolt I/O banks can simultaneously drive 1.5 V, 1.8 V, 2.5 V, and 3.3 V loads without level shifters. The 980-cell capacity is large enough to replicate address decoding, chip-select generation, and interrupt controllers from a 1990s-era motherboard. The 144-TQFP footprint matches the through-hole-to-SMD retrofit pads used in many industrial legacy designs, and the industrial temperature grade supports retrofits in field cabinets.
Direkomendasikan
Communication Protocol Bridging
The EPM1270TI144C5N is a popular choice for protocol-bridging glue logic - SPI to parallel, I2C to UART, parallel to LVDS - because its 212 user I/Os and 201.1 MHz fMAX support simultaneous multi-protocol fan-out without timing collisions. JTAG in-system programmability means a single PCB can be re-flashed for different protocols in production, reducing SKUs. The industrial temperature range makes it appropriate for outdoor telecom infrastructure and roadside controllers.
Direkomendasikan
Safety-Critical State Machines
The EPM1270TI144C5N is well-suited to safety-critical state machines in industrial safety circuits because its non-volatile flash configuration is immune to single-event upsets that affect SRAM-based FPGAs, and its deterministic 6.2 ns propagation delay supports tight watchdog timing windows. The on-chip 8 Kbit user flash block can store firmware CRC values and safety revision codes for IEC 61508 traceability. The industrial -40 °C to +100 °C operating range covers most factory and outdoor safety installations.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM1270TI144C5N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM1270T144C5N | EPM1270T144I5N | EPM1270T144C4N | EPM1270T144C3N | EPM1270T144A5N |
|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macro Cells | 980 | 980 | 980 | 980 | 980 | 980 |
| tPD (pin-to-pin delay) | 6.2 ns (C5) | 6.2 ns (C5) | 6.2 ns (C5) | 5.0 ns (C4) | 3.8 ns (C3) | 6.2 ns (A5) |
| fMAX | 201.1 MHz | 201.1 MHz | 201.1 MHz | Higher (C4) | Higher (C3) | 201.1 MHz |
| Temperature Grade | Industrial (TI): -40 to +100 C | Commercial (TC): 0 to 85 C | Industrial (TI): -40 to +100 C | Commercial (TC) | Commercial (TC) | Industrial (TA) |
| JTAG / ISP | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
Diferensiator Kunci
- Highest-density member of the MAX II CPLD family (vsEPM240T100I5N)
- Industrial temperature range with 144-TQFP footprint (vsEPM1270T144C5N)
- C5 speed grade with 6.2 ns tPD for deterministic timing (vsEPM1270T144C3N)
Catatan Desain
Estimated: the EPM1270TI144C5N draws roughly 50-150 mA active and under 5 mA standby from VCCINT (3.3 V), depending on switching activity. Place a 0.1 µF X7R ceramic decoupling cap within 5 mm of every VCCINT/VCCIO pair, plus one 10 µF bulk capacitor per bank to meet simultaneous-switching output (SSO) limits when all 212 I/Os toggle simultaneously at 100 MHz. The MultiVolt I/O banks let you supply 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails simultaneously to four separate banks.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω characteristic impedance and keep traces under 100 mm to avoid ringing. Add 10 kΩ pull-ups on nCONFIG and TMS, and a 10 kΩ pull-down on TCK as recommended by the MAX II handbook. The 144-TQFP package has a 0.5 mm pitch - use at least 4-layer PCB stackup with continuous ground plane directly under the device to control SSO-induced ground bounce.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (typically JTAG or AS) and must be tied high or low per the design. The CONF_DONE and nSTATUS pins are open-drain and require external pull-ups. When migrating between speed grades (C3/C4/C5), always re-run Quartus Prime timing analysis because the faster grades have tighter setup/hold windows that may require hold-time fixing on long paths.
Informasi Konformitas
Compliance data not in the verified web sources. Engineers should consult the Intel product lifecycle report or the official RoHS/REACH declaration letter for confirmed status. AEC-Q100 not applicable - CPLDs are not automotive-qualified as standard.