K3KCKC0BM-JGCT vs K3LKCKC0BM-MGCP Perbandingan
Perbandingan bersamaan detil K3KCKC0BM-JGCT dari Samsung Electronics dan K3LKCKC0BM-MGCP dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K3KCKC0BM-JGCT | K3LKCKC0BM-MGCP |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | LPDDR5 SDRAM | LPDDR5 SDRAM (DRAM) |
| Density | 64 Gb | — |
| Antarmuka | LPDDR5 (Low Power Double Data Rate 5) | Parallel |
| Organisasi | [DATA_NEEDED: organization (x32/x16)] | — |
| Package Type | FBGA (fine-pitch ball grid array) | — |
| Ball Count | [DATA_NEEDED: ball count] | — |
| Speed Grade Suffix | JGCT | — |
| Max Pin Speed (family reference K3LKCKC0BM-MGCP) | 6400 Mbps | — |
| Supply Voltage Core (VDD1) | [DATA_NEEDED: VDD1 voltage] | — |
| Supply Voltage I/O (VDD2/VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -25 C to +85 C |
| Tipe Mounting | Surface Mount | Surface Mount |
| Refresh Mode | Self-refresh with partial array self-refresh (PASR) | — |
| Power Features | DVFSC, deep power-down | — |
| Status RoHS | unknown | Compliant |
| Packaging | [DATA_NEEDED: packing type and standard quantity] | — |
| Ukuran Memori | — | 64 Gbit |
| Memory Organization | — | 2G x32 |
| Laju Data | — | 6400 Mbps |
| Technology | — | CMOS |
| Supply Voltages | — | 500 mV, 900 mV, 1.05 V, 1.8 V |
| Paket | — | FBGA-315 (PBGA315) |
| Volatile / Non-Volatile | — | Volatile |
| Clock Frequency | — | [DATA_NEEDED: clock frequency] |
| Access Time | — | [DATA_NEEDED: access time] |
| Power Consumption - Active | — | [DATA_NEEDED: active power] |
| Power Consumption - Standby | — | [DATA_NEEDED: standby power] |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |