K3LKCKC0BM-MGCP vs K3KCKC0BM-JGCT Perbandingan
Perbandingan bersamaan detil K3LKCKC0BM-MGCP dari Samsung Electronics dan K3KCKC0BM-JGCT dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K3LKCKC0BM-MGCP | K3KCKC0BM-JGCT |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | LPDDR5 SDRAM (DRAM) | LPDDR5 SDRAM |
| Ukuran Memori | 64 Gbit | — |
| Memory Organization | 2G x32 | — |
| Laju Data | 6400 Mbps | — |
| Antarmuka | Parallel | LPDDR5 (Low Power Double Data Rate 5) |
| Technology | CMOS | — |
| Supply Voltages | 500 mV, 900 mV, 1.05 V, 1.8 V | — |
| Suhu Kerja | -25 C to +85 C | [DATA_NEEDED: operating temperature range] |
| Paket | FBGA-315 (PBGA315) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Volatile / Non-Volatile | Volatile | — |
| Status RoHS | Compliant | unknown |
| Clock Frequency | [DATA_NEEDED: clock frequency] | — |
| Access Time | [DATA_NEEDED: access time] | — |
| Power Consumption - Active | [DATA_NEEDED: active power] | — |
| Power Consumption - Standby | [DATA_NEEDED: standby power] | — |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 64 Gb |
| Organisasi | — | [DATA_NEEDED: organization (x32/x16)] |
| Package Type | — | FBGA (fine-pitch ball grid array) |
| Ball Count | — | [DATA_NEEDED: ball count] |
| Speed Grade Suffix | — | JGCT |
| Max Pin Speed (family reference K3LKCKC0BM-MGCP) | — | 6400 Mbps |
| Supply Voltage Core (VDD1) | — | [DATA_NEEDED: VDD1 voltage] |
| Supply Voltage I/O (VDD2/VDDQ) | — | [DATA_NEEDED: VDDQ voltage] |
| Refresh Mode | — | Self-refresh with partial array self-refresh (PASR) |
| Power Features | — | DVFSC, deep power-down |
| Packaging | — | [DATA_NEEDED: packing type and standard quantity] |