K4AAG165WA-BCWE vs K4AAG165WM-BCRC Perbandingan
Perbandingan bersamaan detil K4AAG165WA-BCWE dari Samsung Electronics dan K4AAG165WM-BCRC dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | K4AAG165WA-BCWE | K4AAG165WM-BCRC |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Ukuran Memori | 16 Gb (2 GB) | — |
| Memory Organization | 1G x 16 | — |
| Laju Data | 3200 Mbps (DDR4-3200) | 3200 Mbps |
| Tegangan Pemuat | 1.2 V | — |
| Paket | 96-ball FBGA | 96-ball FBGA |
| Package Dimensions | 13 x 9 mm | — |
| Ball Pitch | 0.8 mm | — |
| Suhu Kerja | -40C to +95C | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] |
| Tipe Antarmuka | Parallel, DDR4 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Memory Format | DRAM (Volatile) | — |
| Technology | DDR4 SDRAM, 8n prefetch, bank group architecture | — |
| Status RoHS | Compliant | Compliant |
| Packaging | Tray | — |
| Product Status | Active | — |
| Density | — | 16 Gb |
| Organisasi | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Antarmuka | — | DDR4 (SSTL-12) |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 3200 Mbps] |