K4AAG165WM-BCRC vs K4AAG165WA-BCTD Perbandingan
Perbandingan bersamaan detil K4AAG165WM-BCRC dari Samsung Electronics dan K4AAG165WA-BCTD dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | K4AAG165WM-BCRC | K4AAG165WA-BCTD |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gb | — |
| Organisasi | 1G x 16 | — |
| Laju Data | 3200 Mbps | 2666 Mbps |
| Supply Voltage (VDD) | 1.2 V | — |
| Antarmuka | DDR4 (SSTL-12) | Synchronous, DDR4 |
| Paket | 96-ball FBGA | 96-FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| Data Mask Function | Yes | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] | 0C to +85C |
| CAS Latency (CL) | [DATA_NEEDED: CAS latency at 3200 Mbps] | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Ukuran Memori | — | 16 Gb |
| Memory Organization | — | 1G x 16 |
| Tegangan Pemuat | — | 1.2 V |
| Memory Format | — | Volatile (DRAM) |
| Bank Architecture | — | DDR4 bank-group architecture |
| Technology Family | — | DDR4 SDRAM (Samsung K4AAG165WA series) |
| Application Class | — | Computing, embedded, consumer main memory |
| Package Family | — | FBGA -> fine-pitch BGA -> surface mount |
| Temperature Grade | — | Commercial (0C to +85C) |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |