K4RCH046VM-2CLP vs K4RCH046VM-2CCM Perbandingan
Perbandingan bersamaan detil K4RCH046VM-2CLP dari Samsung Electronics dan K4RCH046VM-2CCM dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4RCH046VM-2CLP | K4RCH046VM-2CCM |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | NRND |
| Tipe Memori | DDR5 SDRAM | DDR5 SDRAM |
| Density | 32 Gb | 32 Gb |
| Organisasi | 4G x 4 | 4G x 4 |
| Laju Data | 6400 Mbps | 5600 Mbps |
| Tegangan Pemuat | 1.1 V | 1.1 V |
| Suhu Kerja | 0C to 85C | 0 to 85 C |
| Paket | 78-FBGA | 78-ball FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Configuration | x4 component | — |
| Antarmuka | DDR5 (SSTL-style low-voltage signaling) | — |
| Family Speed Range (Samsung DDR5) | up to 7200 Mbps | — |
| Family Density Range (Samsung DDR5) | 16 Gb to 32 Gb | — |
| Power Efficiency vs DDR4 | Approx. 30% greater | — |
| Product Status (per distributor listing) | Sample / Active supply via distribution | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Product Status | — | Sample |
| Access Latency (CL) | — | [DATA_NEEDED: CAS latency] |
| Refresh Rate | — | [DATA_NEEDED: refresh rate] |
| Tipe Antarmuka | — | [DATA_NEEDED: interface type] |
| On-Die ECC | — | [DATA_NEEDED: on-die ECC support] |