K4RHE086VP vs K4RHE086VB-BCWM Perbandingan
Perbandingan bersamaan detil K4RHE086VP dari Samsung Electronics dan K4RHE086VB-BCWM dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4RHE086VP | K4RHE086VB-BCWM |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DDR5 | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 24 Gb |
| Organisasi | x8 | 2G x 8 |
| Process Node | 1a-class (D1a) | — |
| Package Type | FBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Tipe Antarmuka | DDR5 (double data rate 5) | — |
| Maximum Data Rate | [DATA_NEEDED: speed bin data rate] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD in V] | — |
| On-Die ECC | Yes (DDR5 standard feature) | [DATA_NEEDED: on-die ECC support] |
| Bank Groups | [DATA_NEEDED: bank group count] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: temperature range] | — |
| Merek | Samsung Electronics | — |
| Product Family | Samsung K4RHE DDR5 series | — |
| Typical Application | Server / client DRAM modules | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Laju Data | — | 5600 Mbps |
| Tegangan Pemuat | — | 1.1 V |
| Paket | — | 82 FBGA |
| Antarmuka | — | DDR5 (JEDEC) |
| Configuration | — | x8 |
| Application Segment | — | Server / Data Center / Premium PC |
| Manufacturer | — | Samsung Semiconductor |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| Package Height | — | [DATA_NEEDED: package height] |