LPC55S26JBD64Y vs LPC55S28JBD64Y Perbandingan
Perbandingan bersamaan detil LPC55S26JBD64Y dari NXP Semiconductors dan LPC55S28JBD64Y dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | LPC55S26JBD64Y | LPC55S28JBD64Y |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 | ARM Cortex-M33 |
| Core Size | 32-Bit | 32-bit |
| Frekuensi Bawah Maximum | 150 MHz | 150 MHz |
| Program Flash Memory | 256 KB (256K x 8) | — |
| Tegangan Pemuat | 3.3 V | — |
| Paket | 64-HTQFP (10 x 10 mm), exposed pad | 64-HTQFP (10x10 mm), Square |
| Tipe Mounting | Surface Mount (Gull Wing terminals) | Surface Mount |
| Temperature Grade | Industrial | Industrial |
| Product Series | LPC552x / LPC55S2x | — |
| Process Technology | 40-nm NVM | 40 nm NVM |
| Number of Terminals | 64 | 64 |
| Package Shape | Square | — |
| SRAM Size | [DATA_NEEDED: SRAM size] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Peripheral Compatibility | Pin-, software- and peripheral-compatible with LPC552x/S2x family | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Core Revision | — | r0p3 |
| Flash Memory | — | 512 KB (512K x 8) |
| Connectivity | — | Flexcomm, I2C, SDIO, SPI, UART/USART, USB |
| Memory Protection Unit (MPU) | — | Yes |
| Interrupt Controller | — | NVIC (built-in) |
| NMI Input | — | Yes, with selectable sources |
| Terminal Form | — | Gull Wing |
| Product Family | — | LPC55S2x (EdgeVerse platform) |
| Packaging Suffix | — | Y = Tape & Reel |