M7AFS600-1FG256 vs M7AFS600-FG256I Perbandingan

Perbandingan bersamaan detil M7AFS600-1FG256 dari Microchip Technology dan M7AFS600-FG256I dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Microchip Technology
M7AFS600-1FG256 M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip

M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip

M7AFS600-1FG256 ✓ Aktif
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum M7AFS600-1FG256 M7AFS600-FG256I
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Logic Family Microsemi Fusion (M7AFS600) —
System Gates 600K 600K
Embedded Processor Core ARM CoreMP7 (32-bit) —
Embedded Flash Configuration Memory 110592 bits —
Number of User I/O 119 —
Core Supply Voltage 1.5 V 1.5 V
Core Supply Voltage Range 1.425 V to 1.575 V —
Process Technology 130 nm flash-based 130 nm
Configuration Type Non-volatile Flash, single-chip, instant-on —
Maximum Frequency 1282.05 MHz (per distributor listing) —
Paket 256-ball FBGA/LBGA (FG256) —
Tipe Mounting Surface Mount —
Suhu Kerja -40C to +85C —
Packaging Tray Tray
Speed Grade -1 (standard) —
Status RoHS [DATA_NEEDED: RoHS status] —
Total Package Balls 256 —
Series — M7AFS600 (Fusion)
Logic Capacity (DigiKey listing) — 110592
Number of I/O — 119 I/O
Embedded Processor — ARM CoreMP7
Paket / Case — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
Gaya Mounting — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

Spek dan Sumber

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