MC56F8355VFGE vs MC56F8347VVFE Perbandingan
Perbandingan bersamaan detil MC56F8355VFGE dari NXP Semiconductors dan MC56F8347VVFE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC56F8355VFGE - 16-Bit 60MHz DSC 256KB Flash LQFP-128 | NXP
MC56F8355VFGE ✓ AktifNXP Semiconductors
MC56F8347VVFE - 16-Bit 60MHz DSP MCU, 128KB Flash, 160-MAPBGA | NXP
MC56F8347VVFE NrndPerbandingan Spesifikasi
| Parameter Umum | MC56F8355VFGE | MC56F8347VVFE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Processor | 56800E | — |
| Core Size | 16-Bit | — |
| Core Architecture | DSC (Digital Signal Controller) | 56800E 16-bit Digital Signal Controller |
| Maximum Clock Speed | 60 MHz | — |
| Program Memory Size | 256 KB (128K x 16) | 128 KB (64K x 16) |
| Program Memory Type | FLASH | FLASH |
| Number of I/O Pins | 49 | — |
| Connectivity | CANbus, EBI/EMI, SCI, SPI | — |
| Peripherals | POR, PWM, Temperature Sensor, WDT | — |
| Tegangan Pemuat | 3.3 V | [DATA_NEEDED: exact VDD range] |
| Paket | 128-LQFP (14x20 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40C to +105C | [DATA_NEEDED: industrial temp grade range] |
| Level MSL | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Series | 56F8xxx | — |
| Instruction Set | CISC | — |
| Lead-Free | Yes | — |
| Core Frequency (Max) | — | 60 MHz |
| RAM Size | — | 12 KB (6K x 16) |
| Number of I/O | — | 76 |
| Paket / Case | — | 160-MAPBGA (15x15 mm) |
| Oscillator Type | — | External |
| ADC | — | 12-bit integrated |
| Communication Interfaces | — | SSI, SPI, dual SCI (UART) |
| PWM Outputs | — | Yes (motor-control peripherals) |
| Timers | — | Quad Timer module |
| Debug Interface | — | JTAG / OnCE |
| Pitch | — | [DATA_NEEDED: BGA ball pitch] |
| Packaging | — | Tray |