MC68EN360ZQ33L vs MC68EN360VR33L Perbandingan
Perbandingan bersamaan detil MC68EN360ZQ33L dari NXP Semiconductors dan MC68EN360VR33L dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP
MC68EN360VR33L ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MC68EN360ZQ33L | MC68EN360VR33L |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Processor Type | M683xx CPU32+ 32-Bit | M683xx 32-bit CPU32+ |
| Core Architecture | CPU32+ with MMU | CPU32+ with QUICC RISC communications engine |
| Clock Speed | 33 MHz | — |
| Tegangan Pemuat Kerja | 5 V | — |
| Number of Cores | 1 | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Instruction Set | 68K / CPU32+ | M68k (CPU32+) binary-compatible |
| Integrated Communication Engine | QUICC (SCC x4, SMC x2) | — |
| Integrated Ethernet MAC | 10/100 Mbps Fast Ethernet | — |
| Serial Interfaces | SCC x4, SMC x2, I2C, SPI | — |
| DMA Channels | 16 | 2 (per QUICC engine) |
| Paket / Case | 357-BBGA / 357-PBGA (25 x 25 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial | — |
| Lead Free Status | Contains Lead | — |
| Status RoHS | RoHS Non-Compliant | — |
| Packaging | Tray | Tray |
| Core Count | — | 1 |
| Bus Speed / Operating Frequency | — | 33 MHz |
| Lebar Bus Data | — | 32-bit |
| Address Bus Width | — | 32-bit (4 GB space) |
| Tegangan Pemuat | — | 5 V |
| Ethernet MAC | — | Integrated 10/100 Ethernet (MII interface) - 'EN' suffix |
| Serial Communication Channels (SCC) | — | 4 (per QUICC engine) |
| Timers | — | 4 general-purpose 16-bit timers |
| DRAM Controller | — | Integrated, supports FPM/EDO DRAM |
| Interrupt Controller | — | Integrated, programmable priority |
| Paket | — | 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') |
| Suhu Kerja | — | -40C to +85C (industrial) |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Process Technology | — | 0.57 um CMOS (per Freescale datasheet) |