MC9S08QD2CSCR vs MC9S08QD4CSC Perbandingan
Perbandingan bersamaan detil MC9S08QD2CSCR dari NXP Semiconductors dan MC9S08QD4CSC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08QD2CSCR | MC9S08QD4CSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Core Processor | S08 | S08 (HCS08), 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Instruction Set Architecture | CISC | — |
| Speed (Bus Frequency) | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 2KB (2K x 8) | — |
| RAM Size | 128 x 8 | — |
| Number of I/O | 4 | — |
| Tegangan Pemuat | 3.3 V / 5 V | 3.3 V / 5 V |
| Oscillator Type | Internal | — |
| Paket / Case | 8-SOIC (0.154 in, 3.90 mm Width) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tape & Reel | Tube |
| Technology | CMOS | — |
| Product Series | S08QD (9S08QD4 SERIES per distributor listing) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Frekuensi Bawah Maximum | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Paket | — | 8-SOIC |
| Life Cycle Stage | — | End of Life (per NXP product page) |