MC9S12D64MFUE vs MC9S12D64CFUER Perbandingan
Perbandingan bersamaan detil MC9S12D64MFUE dari NXP Semiconductors dan MC9S12D64CFUER dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S12D64MFUE | MC9S12D64CFUER |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Architecture | HCS12 (16-bit CISC) | — |
| CPU Core | S12 CPU V2 | — |
| Operating Frequency | 25 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 64 KB (64K x 8) | 64 KB (64K x 8) Flash |
| Paket | 80-QFP (14 x 14 mm), also called PQFP-80 | — |
| Tipe Mounting | Surface Mount (SMD/SMT) | Surface Mount |
| Tegangan Pemuat | 2.5 V / 5 V | — |
| Number of I/O | 59 | 59 |
| ADC | 2 x 10-bit, 8 channels each (16 ADC channels total) | — |
| PWM Channels | 8 channels | — |
| Capture/Compare Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC | — |
| Rentang Suhu Kerja | -40 C to +125 C | — |
| Automotive Qualification | AEC-Q100 | — |
| Status RoHS | Compliant | Compliant |
| Packaging Method (tray / reel) | Tray | — |
| Approximate Weight | 0.033 oz (per supplier catalog) | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Watchdog / COP | Yes (COP reset, watchdog timer) | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | HCS12 / S12D |
| Core Processor | — | HCS12 (16-bit CISC) |
| Core Size | — | 16-Bit |
| Speed | — | 25 MHz |
| RAM Size | — | 4 KB |
| Connectivity | — | CAN, SCI, SPI |
| Peripherals | — | PWM, 8-ch 10-bit ADC, Timers, BDM |
| Oscillator Type | — | Internal |
| Operating Voltage | — | 2.5 V / 5 V |
| Paket / Case | — | 80-QFP (14x14 mm) |
| Packaging | — | Tape & Reel (TR) |
| Temperature Grade | — | Industrial |