MC9S12D64MFUE vs MC9S12D64CFUER 比較

詳細並排比較 MC9S12D64MFUE 由 NXP Semiconductors 與 MC9S12D64CFUER 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12D64MFUE MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE Nrnd
NXP Semiconductors
MC9S12D64CFUER MC9S12D64CFUER - 16-bit HCS12 MCU, 64KB Flash | NXP

MC9S12D64CFUER - 16-bit HCS12 MCU, 64KB Flash | NXP

MC9S12D64CFUER ✓ 啟用中

規格比較

參數 MC9S12D64MFUE MC9S12D64CFUER
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 啟用中
Core Architecture HCS12 (16-bit CISC) —
CPU Core S12 CPU V2 —
Operating Frequency 25 MHz —
Program Memory Type Flash —
Program Memory Size 64 KB (64K x 8) 64 KB (64K x 8) Flash
封裝 80-QFP (14 x 14 mm), also called PQFP-80 —
安裝類型 Surface Mount (SMD/SMT) Surface Mount
供應電壓 2.5 V / 5 V —
Number of I/O 59 59
ADC 2 x 10-bit, 8 channels each (16 ADC channels total) —
PWM Channels 8 channels —
Capture/Compare Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC —
工作溫度範圍 -40 C to +125 C —
Automotive Qualification AEC-Q100 —
RoHS 狀態 Compliant Compliant
Packaging Method (tray / reel) Tray —
Approximate Weight 0.033 oz (per supplier catalog) —
Debug Interface BDM (Background Debug Mode) —
Watchdog / COP Yes (COP reset, watchdog timer) —
Manufacturer — NXP Semiconductors
Series — HCS12 / S12D
Core Processor — HCS12 (16-bit CISC)
Core Size — 16-Bit
Speed — 25 MHz
RAM Size — 4 KB
Connectivity — CAN, SCI, SPI
Peripherals — PWM, 8-ch 10-bit ADC, Timers, BDM
Oscillator Type — Internal
Operating Voltage — 2.5 V / 5 V
封裝 / 外殼 — 80-QFP (14x14 mm)
Packaging — Tape & Reel (TR)
Temperature Grade — Industrial

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