MCF54451CVM180 vs MCF54451VM240 Perbandingan

Perbandingan bersamaan detil MCF54451CVM180 dari NXP Semiconductors dan MCF54451VM240 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MCF54451CVM180 MCF54451CVM180 - 180MHz ColdFire V4 MPU 256-MAPBGA | NXP

MCF54451CVM180 - 180MHz ColdFire V4 MPU 256-MAPBGA | NXP

MCF54451CVM180 Nrnd
NXP Semiconductors
MCF54451VM240 MCF54451VM240 - ColdFire V4 MPU, 240 MHz, MAPBGA-256 | NXP

MCF54451VM240 - ColdFire V4 MPU, 240 MHz, MAPBGA-256 | NXP

MCF54451VM240 Nrnd

Perbandingan Spesifikasi

Parameter Umum MCF54451CVM180 MCF54451VM240
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core ColdFire V4 (V4M) with MMU and EMAC ColdFire V4 (Version 4 with MMU and EMAC)
Core Architecture 32-bit RISC, Variable-Length Encoding (m68k lineage) —
Maximum Core Frequency 180 MHz —
Dhrystone 2.1 MIPS up to 410 MIPS @ 266 MHz (family spec) —
Instruction Cache 16 KB 16 KByte
Data Cache 16 KB 16 KByte
Internal SRAM 32 KB —
Program Memory (ROM/Flash) ROMless —
Paket 256-MAPBGA, 17 mm x 17 mm 256-MAPBGA (17x17 mm)
Supply Voltage (Core/IO) 1.8 V / 2.5 V / 3.3 V —
Ethernet Integrated MAC (10/100) —
USB USB On-The-Go (OTG) —
PCI PCI 2.x interface integrated —
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Rentang Suhu Kerja [DATA_NEEDED: operating temperature range] —
Level MSL [DATA_NEEDED: MSL level] —
Status RoHS Compliant —
Operating Frequency — 240 MHz
DMIPS — up to 410 Dhrystone 2.1 MIPS
Program Memory Type — ROMless (external boot flash required)
RAM Size — 32K x 8 on-chip SRAM
I/O Count — 132
Tegangan Pemuat — [DATA_NEEDED: core and I/O rail voltages]
Suhu Kerja — -40C to +85C (industrial)
Connectivity — 10/100 Ethernet MAC, USB OTG, PCI
Memory Controller — DDR/DDR2 SDRAM + NAND flash controller
Status Lingkungan Hidup — NRND (Not Recommended for New Designs)
Packaging — Tray

Spek dan Sumber

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