MPC8265AVVPIBC vs MPC8250AZUPIBC Perbandingan
Perbandingan bersamaan detil MPC8265AVVPIBC dari NXP Semiconductors dan MPC8250AZUPIBC dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC8265AVVPIBC | MPC8250AZUPIBC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Manufacturer | NXP USA Inc. | — |
| Series | MPC82xx | MPC82xx (PowerQUICC II) |
| Core Processor | PowerPC G2 | PowerPC G2 |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Bus Width | 32-Bit | — |
| Speed (Clock) | 300 MHz | — |
| Co-Processors / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | No | — |
| Ethernet | 10/100 Mbps (2x MAC) | — |
| USB | No | — |
| SATA | No | — |
| PCI | Yes (PCI bridge) | — |
| Operating Voltage | 3.3 V (core/IO); 2.0 V internal | — |
| Process Technology | 0.25 um CMOS | 0.25 µm CMOS |
| Suhu Kerja | -40C to +85C (industrial) | -40 °C to +85 °C (industrial) |
| Paket / Case | 480-TBGA (37.5 x 37.5 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Part Status | Not For New Designs (NRND) | — |
| Core Speed | — | 300 MHz |
| Coprocessor | — | Communications (HIP4C) |
| Paket | — | 480-TBGA (37.5 x 37.5 mm) |
| Tegangan Pemuat | — | 3.3 V I/O |
| External Bus Width | — | 32-Bit (60x-compatible) |
| Cache | — | [DATA_NEEDED: L1 / L2 cache sizes] |
| L1 Instruction Cache | — | 16 Kbyte |
| L1 Data Cache | — | 16 Kbyte |
| Peripherals | — | PCI, HDLC, Fast Ethernet, ATM, TDM |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |