MPC8265AVVPIBC vs MPC8250AZUPIBC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8265AVVPIBC disebabkan oleh NXP Semiconductors dan MPC8250AZUPIBC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC8265AVVPIBC | MPC8250AZUPIBC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Manufacturer | NXP USA Inc. | — |
| Series | MPC82xx | MPC82xx (PowerQUICC II) |
| Core Processor | PowerPC G2 | PowerPC G2 |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Bus Width | 32-Bit | — |
| Speed (Clock) | 300 MHz | — |
| Co-Processors / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | No | — |
| Ethernet | 10/100 Mbps (2x MAC) | — |
| USB | No | — |
| SATA | No | — |
| PCI | Yes (PCI bridge) | — |
| Operating Voltage | 3.3 V (core/IO); 2.0 V internal | — |
| Process Technology | 0.25 um CMOS | 0.25 µm CMOS |
| Suhu Operasi | -40C to +85C (industrial) | -40 °C to +85 °C (industrial) |
| Kemasan / Case | 480-TBGA (37.5 x 37.5 mm) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Part Status | Not For New Designs (NRND) | — |
| Core Speed | — | 300 MHz |
| Coprocessor | — | Communications (HIP4C) |
| Kemasan | — | 480-TBGA (37.5 x 37.5 mm) |
| Tegangan Pemberi Arus | — | 3.3 V I/O |
| External Bus Width | — | 32-Bit (60x-compatible) |
| Cache | — | [DATA_NEEDED: L1 / L2 cache sizes] |
| L1 Instruction Cache | — | 16 Kbyte |
| L1 Data Cache | — | 16 Kbyte |
| Peripherals | — | PCI, HDLC, Fast Ethernet, ATM, TDM |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |