MPC8358ZQAGDDA vs MPC8358VRAGDGA Perbandingan
Perbandingan bersamaan detil MPC8358ZQAGDDA dari NXP Semiconductors dan MPC8358VRAGDGA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8358ZQAGDDA - PowerQUICC II Pro 400MHz CPU | NXP | BGA-668
MPC8358ZQAGDDA ObsoleteNXP Semiconductors
MPC8358VRAGDGA - 400MHz PowerQUICC II Pro MPU | NXP
MPC8358VRAGDGA ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPC8358ZQAGDDA | MPC8358VRAGDGA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Processor Type | PowerPC e300 Microprocessor IC (PowerQUICC II Pro) | PowerPC e300 Microprocessor IC MPC83xx |
| Series | MPC83xx | — |
| Core Architecture | PowerPC, 32-bit | Power Architecture (e300), 32-bit |
| Core Count | 1 | — |
| Core Speed | 400 MHz | — |
| Supply Voltage (Core) | 1.2 V | — |
| Memory Controller | DDR1 / DDR2 with ECC | — |
| Ethernet | 1 Gbit/s (RGMII/GMII) | 2x 10/100/1000 (one RGMII, one SGMII/GMII), 1 GbE MAC |
| PCI | 32-bit, up to 66 MHz | — |
| USB | USB 2.0 full-speed PHY | USB 2.0 Full/Low Speed |
| TDM / ATM | Multi-channel TDM / ATM glue | — |
| Suhu Kerja | 0C to +105C | 0 C to +105 C |
| Paket | 668-BGA (PBGA-PGE) 29x29 mm with exposed pad | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Lead Free Status | Lead Free | Lead Free |
| Status RoHS | Compliant | Compliant |
| Packaging | Tray | Tray |
| Core Clock Speed | — | 400 MHz |
| Number of Cores | — | 1 |
| Core Voltage | — | 1.2 V |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Paket / Case | — | 668-PBGA-PGE (29x29) with exposed pad |
| Memory Interface | — | DDR1 / DDR2 SDRAM controller with ECC |
| PCI Interface | — | 32-bit PCI 2.3 |
| WAN Interfaces | — | TDM (T1/E1/HSSI), ATM UTOPIA, 4 channels |
| Security Engine | — | AES, DES, 3DES, PKE |
| Process Technology | — | 0.13 micrometer CMOS |
| Family | — | MPC83xx PowerQUICC II Pro |