MPC855TVR50D4 vs MPC860TCZQ50D4 Perbandingan
Perbandingan bersamaan detil MPC855TVR50D4 dari NXP Semiconductors dan MPC860TCZQ50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MPC855TVR50D4 | MPC860TCZQ50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | PowerPC |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | — |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | — |
| Cache Size | 8 KB unified instruction/data | — |
| Tegangan Pemuat | 2.0 V to 3.6 V | — |
| Suhu Kerja | 0 C to +95 C (commercial) | -40C to +95C (industrial) |
| Paket | 357-Ball PBGA (25x25 mm) | 357-PBGA (25x25 mm), ZQ suffix |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | Up to 256 MB DRAM with page mode support |
| Core Marking Family | MPC85xx | — |
| Level MSL | 3 | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free | [DATA_NEEDED: lead-free status] | Contains lead (ZQ denotes tin-lead ball finish) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Core Clock Speed | — | 50 MHz |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Tegangan Pemuat Kerja | — | 2 V to 3.6 V (per FindIC comparison page) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Process Technology | — | 0.32 um CMOS (per FindIC description) |
| Status Lingkungan Hidup | — | End of Life (NXP Last Time Buy window passed) |