MPC860TZQ66D4 vs MPC860ENCVR50D4 Perbandingan
Perbandingan bersamaan detil MPC860TZQ66D4 dari NXP Semiconductors dan MPC860ENCVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860TZQ66D4 | MPC860ENCVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Manufacturer | NXP Semiconductors | — |
| Part Family | MPC8xx PowerQUICC | — |
| Core Architecture | PowerPC, 32-bit | 32-Bit PowerPC |
| Core Count | 1 | 1 |
| Core Frequency | 66 MHz | — |
| Tegangan Pemuat | 3.3 V | — |
| Paket / Case | 357-PBGA (25x25 mm) | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray | Tray |
| Suhu Kerja | 0 °C to +70 °C | — |
| Lead Free Status | Contains Lead | Lead Free |
| Status RoHS | RoHS non-compliant (Contains Lead) | RoHS Compliant |
| Communications Module | CPM (QUICC Engine) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status Lingkungan Hidup | End of Life (per NXP) | — |
| Kategori | Microprocessors - MPU | — |
| Processor Type | — | MPU PowerQUICC MPC8xx |
| Frekuensi Bawah Maximum | — | 50 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Process Technology | — | 0.32 um CMOS |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| On-chip Peripherals | — | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC |
| Series | — | MPC8xx PowerQUICC |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |