MPC875ZT133 vs MPC870VR66 Perbandingan

Perbandingan bersamaan detil MPC875ZT133 dari NXP Semiconductors dan MPC870VR66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC875ZT133 MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors

MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors

MPC875ZT133 ✗ Akhir Hidup
NXP Semiconductors
MPC870VR66 MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MPC875ZT133 MPC870VR66
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Aktif
Core Architecture Power Architecture (PowerPC) 32-bit —
Core Count 1 1
Core Frequency 133 MHz —
Family MPC8xx / PowerQUICC —
Paket 256-ball PBGA (23x23 mm) —
Package Code HBGA, Grid Array with Heat Sink/Slug —
Suhu Kerja 0C to +95C —
Maximum Supply Voltage 1.9 V —
Terminal Form BALL —
Number of Terminals 256 —
Tipe Mounting Surface Mount Surface Mount
Communications Processor Module (CPM) Yes (on-chip) —
Ethernet MAC 10/100 Mbps (Fast Ethernet, integrated) —
Memory Controller External SDRAM/Flash bus (integrated) —
Status Lingkungan Hidup End of Life (per NXP discontinuance notice) —
Status RoHS [DATA_NEEDED: rohs status] RoHS Compliant
Instruction Set Power Architecture 32-bit —
Manufacturer — NXP Semiconductors
Series — PowerQUICC, MPC8xx
Core Processor — MPC8xx Power Architecture
Lebar Bus Data — 32-bit
Speed — 66 MHz
Performance — 87 MIPS
Tegangan Pemuat Kerja — 3.3 V
Rentang Suhu Kerja — 0C to +95C
Paket / Case — 256-BGA (PBGA), 23x23 mm
Packaging — Tray
Lead Free Status — Lead Free
Processor Type — MPC8xx PowerQUICC Communications Processor

Spek dan Sumber

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