MPC875ZT133 vs MPC870VR66 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC875ZT133 disebabkan oleh NXP Semiconductors dan MPC870VR66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC875ZT133 MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors

MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors

MPC875ZT133 ✗ Akhir Hayat
NXP Semiconductors
MPC870VR66 MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 ✓ Aktif

Pengandingan Spesifikasi

Parametr MPC875ZT133 MPC870VR66
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Aktif
Core Architecture Power Architecture (PowerPC) 32-bit —
Core Count 1 1
Core Frequency 133 MHz —
Family MPC8xx / PowerQUICC —
Kemasan 256-ball PBGA (23x23 mm) —
Package Code HBGA, Grid Array with Heat Sink/Slug —
Suhu Operasi 0C to +95C —
Maximum Supply Voltage 1.9 V —
Terminal Form BALL —
Number of Terminals 256 —
Jenis Pemasangan Surface Mount Surface Mount
Communications Processor Module (CPM) Yes (on-chip) —
Ethernet MAC 10/100 Mbps (Fast Ethernet, integrated) —
Memory Controller External SDRAM/Flash bus (integrated) —
Status Lingkungan Hidup End of Life (per NXP discontinuance notice) —
Status RoHS [DATA_NEEDED: rohs status] RoHS Compliant
Instruction Set Power Architecture 32-bit —
Manufacturer — NXP Semiconductors
Series — PowerQUICC, MPC8xx
Core Processor — MPC8xx Power Architecture
Lebar Bus Data — 32-bit
Speed — 66 MHz
Performance — 87 MIPS
Tegangan Pemberi Arus Operasi — 3.3 V
Gambaran Suhu Operasi — 0C to +95C
Kemasan / Case — 256-BGA (PBGA), 23x23 mm
Packaging — Tray
Lead Free Status — Lead Free
Processor Type — MPC8xx PowerQUICC Communications Processor

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga