MPX5010GP vs MPX5010GSX Perbandingan

Perbandingan bersamaan detil MPX5010GP dari NXP Semiconductors dan MPX5010GSX dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPX5010GP MPX5010GP - 0-10kPa Vented Gauge Pressure Sensor | NXP

MPX5010GP - 0-10kPa Vented Gauge Pressure Sensor | NXP

MPX5010GP Nrnd
NXP Semiconductors
MPX5010GSX MPX5010GSX - 10kPa Integrated Pressure Sensor 6-SIP | NXP

MPX5010GSX - 10kPa Integrated Pressure Sensor 6-SIP | NXP

MPX5010GSX ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MPX5010GP MPX5010GSX
Merek NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup NRND Aktif
Pressure Type Vented Gauge Vented Gauge
Operating Pressure Range 0 kPa to 10 kPa (0 to 1.45 PSI) 0 kPa to 10 kPa (0 to 1.45 PSI)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] [DATA_NEEDED: maximum overload pressure]
Tegangan Pemuat 4.75 V to 5.25 V (typical 5 V) —
Arus Pemuat [DATA_NEEDED: supply current] [DATA_NEEDED: supply current typical]
Tipe Output Analog, ratiometric Analog Voltage
Rentang Tegangan Output 0.2 V to 4.7 V —
Full-Scale Span 4.5 V (typical) —
Zero Pressure Offset 0.2 V typical at VS = 5 V —
Accuracy ±1.5% (per datasheet, factory calibrated) 1.0 % typical (per datasheet)
Suhu Kerja [DATA_NEEDED: operating temperature range] 0 C to 85 C
Compensated Temperature 0 °C to 85 °C —
Port Configuration Male 0.19" (4.93 mm) tube, single vented port —
Paket 6-SIP module (Unibody) —
Technology Piezoresistive MEMS with on-chip ASIC Piezoresistive MEMS with on-chip ASIC
Tipe Mounting Through-Hole Through Hole
Status RoHS [DATA_NEEDED: RoHS compliance status] Compliant
Lead-Free [DATA_NEEDED: lead-free status] —
Output Voltage Span — 0.2 V to 4.7 V
Supply Voltage (VCC) — 4.5 V to 5.5 V
Response Time — [DATA_NEEDED: response time]
Port Size — Male 0.19 inch (4.93 mm) Tube, Side Port
Paket / Case — 6-SIP Module (Case 867F)
Termination Style — Through-Hole PCB
Media Compatibility — Dry gases (air, non-corrosive)

Spek dan Sumber

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