MPX5050D vs MPX5010D Perbandingan
Perbandingan bersamaan detil MPX5050D dari NXP Semiconductors dan MPX5010D dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPX5050D - 50kPa Differential Pressure Sensor, 5V, SIP-6 | NXP
MPX5050D ✗ Akhir HidupNXP Semiconductors
MPX5010D - 10kPa Differential Pressure Sensor | NXP Semiconductors
MPX5010D ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MPX5050D | MPX5010D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Tipe Pengukur | Differential Pressure Sensor | — |
| Pressure Range | 0 kPa to 50 kPa (0 to 7.25 PSI) | — |
| Tipe Output | Analog, Ratiometric | Analog Voltage |
| Tegangan Output | 0.2 V to 4.7 V | — |
| Tegangan Pemuat | 4.75 V to 5.25 V (5 V typical) | 4.75 V to 5.25 V |
| Arus Pemuat | 7 mA (typical) | [DATA_NEEDED: mA] |
| Linearity | ±1.5% (over 0 to 50 kPa) | — |
| Response Time | 1 ms (typical) | [DATA_NEEDED: ms] |
| Suhu Kerja | -40 °C to +125 °C | 0C to +85C (industrial-grade derivative supported to 40C to +125C) |
| Compensated Temperature | 0 °C to +85 °C | — |
| Port Type | Dual axial ports (P1 high, P2 low) | — |
| Pressure Port Size | 1/16 inch (4.93 mm) tubing | — |
| Paket | 6-SIP Module (Unibody) | — |
| Tipe Mounting | Through-Hole (SIP) | Through-hole module |
| Media Compatibility | Dry, non-corrosive, non-ionic gases | Dry non-corrosive gases (air-referenced diaphragm) |
| Technology | Piezoresistive MEMS with ASIC conditioning | — |
| Output Span | 4.5 V (typical at 5 V supply) | — |
| Manufacturer | — | NXP Semiconductors |
| Pressure Type | — | Differential |
| Operating Pressure | — | 1.45 PSI (10 kPa) max |
| Rentang Tegangan Output | — | 0.2 V to 4.7 V |
| Port Size | — | Dual axial port (Differential) |
| Accuracy | — | [DATA_NEEDED: %FS] |
| Paket / Case | — | 6-SIP Module (Case 867-08) |
| Sensor Technology | — | Piezoresistive MEMS |
| Signal Conditioning | — | On-chip, temperature compensated and calibrated |
| Status RoHS | — | [DATA_NEEDED: verified per datasheet] |