MPX5700DP vs MPX4080D Perbandingan
Perbandingan bersamaan detil MPX5700DP dari NXP Semiconductors dan MPX4080D dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPX5700DP | MPX4080D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 700 kPa (0 psi to 101.5 psi) | 0 kPa to 80 kPa (0 PSI to 11.6 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | [DATA_NEEDED: maximum overload pressure] |
| Tipe Output | Analog voltage, ratiometric | Analog voltage, ratiometric to Vsupply |
| Rentang Tegangan Output | 0.2 V to 4.7 V | — |
| Full-Scale Span (VFSS) | 4.5 V (typical) | — |
| Tegangan Pemuat | 4.75 V to 5.25 V (5 V typical) | 4.85 V to 5.35 V (5.1 V typical) |
| Arus Pemuat | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current] |
| Accuracy | ±2.5% VFSS (0°C to 85°C) | [DATA_NEEDED: combined linearity and temperature error] |
| Suhu Kerja | -40°C to +125°C | — |
| Response Time | 1 ms (typical) | — |
| Port Style | Dual Male 0.19" (4.93 mm) Tube, Horizontal | — |
| Paket / Case | 6-SIP Module (Case 867C-05) | 6-SIP Module (through-hole) |
| Tipe Mounting | Through-hole, vertical SIP | Through-hole |
| Technology | Piezoresistive MEMS, bipolar signal conditioning | Piezoresistive monolithic silicon, single-element |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Output Voltage Span | — | 0.6 V to 4.9 V (typical) |
| Sensitivity | — | [DATA_NEEDED: sensitivity V/kPa] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Port Configuration | — | Differential, single axial port on package top |
| Port Size | — | Female, 0.136 in (3.4544 mm) |
| Termination Style | — | PCB (through-hole) |
| Media Compatibility | — | Dry air (other media require factory consultation) |
| On-Chip Signal Conditioning | — | Yes (amplified, temperature compensated, calibrated) |