MPX5700DP vs MPX4080D 比較

詳細な並列比較: MPX5700DP メーカー: NXP Semiconductors および MPX4080D メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

NXP Semiconductors
MPX5700DP MPX5700DP - 700 kPa Differential Pressure Sensor, 6-SIP | NXP

MPX5700DP - 700 kPa Differential Pressure Sensor, 6-SIP | NXP

MPX5700DP ✓ 生産中
NXP Semiconductors
MPX4080D MPX4080D - 0 to 80 kPa Differential Pressure Sensor | NXP / ST

MPX4080D - 0 to 80 kPa Differential Pressure Sensor | NXP / ST

MPX4080D ✓ 生産中

仕様比較

パラメータ MPX5700DP MPX4080D
ブランド NXP Semiconductors NXP Semiconductors
カテゴリ Pressure Sensors Pressure Sensors
ライフサイクル状態 有効 有効
在庫状況 In Stock In Stock
単価(USD) $9.20 $4.40
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 700 kPa (0 psi to 101.5 psi) 0 kPa to 80 kPa (0 PSI to 11.6 PSI)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] [DATA_NEEDED: maximum overload pressure]
出力タイプ Analog voltage, ratiometric Analog voltage, ratiometric to Vsupply
出力電圧範囲 0.2 V to 4.7 V —
Full-Scale Span (VFSS) 4.5 V (typical) —
電源電圧 4.75 V to 5.25 V (5 V typical) 4.85 V to 5.35 V (5.1 V typical)
電源電流 [DATA_NEEDED: supply current] [DATA_NEEDED: supply current]
Accuracy ±2.5% VFSS (0°C to 85°C) [DATA_NEEDED: combined linearity and temperature error]
動作温度 -40°C to +125°C —
Response Time 1 ms (typical) —
Port Style Dual Male 0.19" (4.93 mm) Tube, Horizontal —
パッケージ / ケース 6-SIP Module (Case 867C-05) 6-SIP Module (through-hole)
実装タイプ Through-hole, vertical SIP Through-hole
Technology Piezoresistive MEMS, bipolar signal conditioning Piezoresistive monolithic silicon, single-element
RoHS ステータス [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Output Voltage Span — 0.6 V to 4.9 V (typical)
Sensitivity — [DATA_NEEDED: sensitivity V/kPa]
動作温度範囲 — [DATA_NEEDED: operating temperature range]
Port Configuration — Differential, single axial port on package top
Port Size — Female, 0.136 in (3.4544 mm)
Termination Style — PCB (through-hole)
Media Compatibility — Dry air (other media require factory consultation)
On-Chip Signal Conditioning — Yes (amplified, temperature compensated, calibrated)

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