MPXM2102D vs MPXM2102A Perbandingan
Perbandingan bersamaan detil MPXM2102D dari NXP Semiconductors dan MPXM2102A dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPXM2102D | MPXM2102A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Differential | — |
| Operating Pressure Range | 0 kPa to 100 kPa (0 psi to 14.5 psi) | 14.5 PSI (100 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure kPa] | — |
| Tipe Output | Analog Voltage (Wheatstone bridge, ratiometric) | Wheatstone Bridge (analog, differential) |
| Tegangan Output | 0 mV to 40 mV at Vex = 10 V | — |
| Sensitivity | 0.4 mV/kPa nominal | — |
| Supply Voltage (Vex) | 10 V typical (up to 16 V max) | — |
| Arus Pemuat | 6 mA typical at 10 V | — |
| Offset (null pressure) | 0 mV to 1 mV nominal | — |
| Linearity | ±0.1% FS typical (±0.5% FS max) | — |
| Temperature Compensation Range | 0C to 85C | — |
| Rentang Suhu Kerja | -40C to +125C | — |
| Storage Temperature | -55C to +150C | — |
| Port Configuration | Dual horizontal ports, differential | — |
| Paket | 5-SMD Module (M-PAK) | 5-SMD Module (MPAK) |
| Tipe Mounting | Surface Mount | Surface Mount, Board Mount |
| Media Compatibility | Dry air and non-corrosive gases | — |
| Status RoHS | Compliant (lead-free M-PAK) | — |
| Tipe Pengukur | — | Absolute Pressure |
| Maximum Overpressure | — | 58.02 PSI (400 kPa) |
| Output Voltage Span | — | 0 mV to 40 mV (at 10 V excitation) |
| Tegangan Pemuat | — | 10 V DC nominal |
| Operating Pressure Range (kPa) | — | 0 kPa to 100 kPa absolute |
| Pressure Port Style | — | No Port (board mount) |
| Bridge Impedance | — | 1.0 kOhm to 4.0 kOhm |
| Suhu Kerja | — | -40C to +125C |
| Termination Style | — | Gull Wing |
| Supplier Device Package | — | 5-MPAK |
| Case Outline | — | CASE 1320 |
| Technology | — | Silicon Piezoresistive, on-chip temperature compensated |